Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To implement longitudinal wiring, by providing a deep hole or a through hole, which is deeper than functional elements or the wirings, at a part where the functional elements or the wiring is not formed, on a semiconductor substrate, in the surface of which the functional elements and the wiring are formed. CONSTITUTION:In the surface of a semiconductor substrate 1, functional elements 5, 6 and 6' are formed. A deep hole 2 or a through hole, which is deeper than the elements 5, 6 and 6' are provided at a part other than the elements. An insulating wall 9 is formed on the hole 2. Then a conductive material 8 is formed at least on the film 9. By using a conductive material, a flat wiring 10, which connects the elements 5, 6 and 6' and a longitudinal wiring or between said elements and other functional elements, is formed. Since the hole 2, wherein metal for wiring is embedded, is provided on the substrate 1, the longitudinal wiring, which electrically connects both surfaces of the semiconductor substrate or electrically connects the layers, can be provided.

Inventors

• 👤 Masaaki Yasumoto
• 👤 安本　雅昭
• 👤 Tadayoshi Enomoto
• 👤 榎本　忠儀

Bibliographic Details