Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To improve mounting density, and to combine various chips by constituting a semiconductor device by superposing a plurality of chips in a multistage manner. CONSTITUTION:When manufacturing a semiconductor device 50, a chip 8 is loaded on a stage 2 in a lead frame 1 while a chip 9 is loaded on a stage 6 in a lead frame 5, and the chips 8, 9 are superposed through the stage 6 and bonded and unified by a tape 10. When stage bars 11, 12 for each lead frame are spot- welded on the unification, the chips are unified positively. Each lead 3 and the terminal sections of each chip 8, 9 are connected by wires 13, several chip 8, 9 and the base sections of several lead 3 are molded with an insulator 14, and lastly connecting sections 15 are cut and removed, thus completing the semiconductor device 50.

Inventors

• 👤 Toshiyuki Yoda
• 👤 敏幸 誉田
• 👤 Junichi Kasai
• 👤 純一 河西
• 👤 Tsuyoshi Aoki
• 👤 強 青木
• 👤 Katsushi Yoshitoshi
• 👤 吉利　勝志
• 👤 Koichi Kobayashi
• 👤 幸一 小林

Bibliographic Details