Chip-on-board mounting substrate

Abstract

Abstract PURPOSE:To obtain an electric shielding effect by forming a conductor land in response to a chip, thereby increasing the mechanical strength. CONSTITUTION:A recess 3 is formed on the surface of a substrate 1, and a semiconductor IC chip 5 is secured by an adhesive 4 in the interior. The prescribed terminal of the chip 5 and the terminal 2 of a circuit on the surface of the substrate 1 are connected via a gold wire 6. The chip 5 and the periphery are sealed with a protecting material 7 made, for example, of epoxy resin. A conductor land 8 is bonded to the position corresponding to the chip 5 on the opposite side to the chip bonding side of the substrate 1. The land 8 is larger than the chip 5 and further the recess 3 in size, and disposed to cover the chip 5 and the recess 3 as seen from a perpendicular direction to the surface of the substrate. Since the land 8 is covered on the recess 3, reinforcing effect can be particularly increased.

Inventors

• 👤 Masayoshi Murotomi
• 👤 室冨　正佳
• 👤 Yasunaga Satoi
• 👤 里井　庸修

Bibliographic Details