Photosensitive polyimide soluble in organic solvent

Abstract

Abstract PURPOSE:The titled polyimide excellent in heat resistance and electrical and mechanical properties and suitable as, for example, a material for insulation films for solid elements in the semiconductor industry, comprising a polycondensate of a specified aromatic diamine with an aromatic polycarboxylic acid. CONSTITUTION:An aromatic tetracarboxylic acid (dianhydride) containing at least two benzene rings (e.g., 3,3',4,4'-biphenyltetracarboxylic acid) is reacted with an aromatic diamine of the formula (wherein X and Y are each H, alkyl or alkoxy, provided that they must not be hydrogen atoms at the same time), e.g., 4'-methyl-3',4-diaminochalcone, in substantially equimolar amounts at a temperature <= about 100 deg.C in an organic solvent (e.g., N,N-dimethyl sulfoxide). The produced polyamic acid solution is diluted with an organic solvent and then imidated at a temperature <= about 100 deg.C in the presence of an imidating agent (e.g., pyridine or acetic anhydride) to form an organic solvent-soluble photosensitive polyimide.

Inventors

• 👤 Tsunetomo Nakano
• 👤 中野　常朝
• 👤 Hiroshi Yasuno
• 👤 安野　弘
• 👤 Kazuaki Nishio
• 👤 一章 西尾
• 👤 Haruyori Tanaka
• 👤 啓順 田中

Bibliographic Details