Manufacture of semiconductor device and the same device

Abstract

Abstract PURPOSE:To prevent a moisture from immersing to a fuse or an electrode pad lower layer by testing part of the fuse and the electrode pad in the open state, repairing a defect, and then covering a necessary portion. CONSTITUTION:A passivation film 22 is covered on the overall surface of a DRAM, the film 22 on a fuse 4 and an electrode pad 20 is etched to form holes 21, 24. A probe 25 is contacted with the exhibited portion 20A of the pad 20 to flow a current in an internal circuit, thereby testing the characteristics. An overcurrent is flowed through the selected fuse 4 to fusion-break the narrow portion 4a in the central width on the basis of the test to countermeasure the defect. After the test is completed, a passivation film 27 is covered on the overall surface. Then, the films 27, 22 are etched to newly form a hole 28 to expose the pad 20B of the position different from a crack 28 occurred in the test. The completed DRAM is subjected to wiring-connection to electrode pads having no crack.

Inventors

• 👤 Shinji Udo
• 👤 有働　信治
• 👤 Masanori Hiroki
• 👤 尋木　正紀

Bibliographic Details