Semiconductor device

Abstract

Abstract PURPOSE:To improve the reliability by arranging the interval between the centers of bonding pads densely at the center of the side of a semiconductor chip and roughly toward the end, thereby eliminating the contact of adjacent bonding wirings. CONSTITUTION:The interval between the centers of bonding pads 4 of a semiconductor chip 3 is arranged densely at the center of the side of the chip and roughly toward the end. Thus, the adjacent bonding wirings 5 are not contacted at the end of each side of the chip, not passed on the adjacent bonding pads 4, thereby obtaining a semiconductor device having high reliability.

Inventors

• 👤 Eigo Fuse
• 👤 布旋　英悟

Bibliographic Details