Method for manufacturing multilayer wiring members

Abstract

Abstract PURPOSE:To contrive to upgrade the reliability of a multilayer interconnection member and the integration degree thereof by a method wherein a trapezoidal insulating film is formed at the lower part of a lower layer wiring, the lower layer wiring is formed in such a way that a part of the lower layer wiring is at least superposed on the top surface part of the insulating film, an insulating film is formed and an upper layer wiring is formed in such a way as to connect electrically with the top surface part of the lower layer wiring. CONSTITUTION:An insulating film 2 is formed on the whole surface of the upper part of a semiconductor substrate 1 and a trapezoidal insulating film (pedestal) 3 is formed on a part on the insulating film 2, where a first-layer wiring is electrically connected with a second-layer wiring. For forming the first-layer wiring, a conductive layer of an Al film, for example, is formed on the whole surface, a patterning is selectively performed thereon; and a first-layer wiring 4A, which has been provided in such a way as to superpose on the pedestal 3 for electrically connecting with the second-layer wiring, and a first-layer wiring 4B adjacent to the wiring 4A at a space of the minimum wiring between the wirings 4A and 4B, are formed. An insulating film 5 is formed on the whole surface and a second-layer wiring 6 is selectively formed on the upper part of the insulating film 5 in such a way as to electrically connect with the top surface part 4a of the wiring 4A.

Inventors

• 👤 Takahiko Takahashi
• 👤 高橋　貴彦
• 👤 Shigeo Kuroda
• 👤 黒田　重雄
• 👤 Nobuo Owada
• 👤 伸郎 大和田

Bibliographic Details