Lead frame

Abstract

Abstract PURPOSE:To avoid the disconnection of bonding wires by preventing lead slippage by a method wherein dumpers between adjacent lead-out leads are selectively removed, when supporting frames are projected respectively out of the frame bodies of lead frame which are opposed to each other, an island for loading a semiconductor element being fixed to the tips of the former frames, and lead-out leads going toward the island being then formed from the dumpers connecting the frame bodies. CONSTITUTION:The supporting leads 22 are projected respectively out of the frame bodies 23 opposed to each other which constitute the lead frame 30, and the island 20 for loading the semiconductor element 21 is connected to the tips of the leads. The lead-out leads 24 consisting of outer leads 24b and inner leads 24a are projected out of the frame bodies 23 toward the island 20, and lead-out leads 24 of the same construction are formed toward the island 20 also from the dumpers 25 connecting the opposing frame bodies 23. In this construction, the dumpers 25 positioned between the adjacent leads 24 are selectively provided with broken parts, and the positional slipping of the leads 24a is absorbed here, resulting in the elimination of the disconnection of bonding wires.

Inventors

• 👤 Ko Aso
• 👤 麻生　香

Bibliographic Details