Lead frame

Abstract

Abstract PURPOSE:To correct the dispersion of the supplied amount of paste used for mounting a semiconductor element by a method wherein the periphery of the part of a bed scheduled for mounting said element is provided with grooves. CONSTITUTION:The periphery of the part scheduled for mounting the element in the main surface of the bed 3 of the lead frame is provided with four slender grooves 81-84 isolated from each other at the corners of a square. By this constitution, when the element 6 is mounted on the bed 3 via paste 7 by the supply of a fixed amount of paste to the bed 3 and then the pressure of the element to said paste, the paste 7 squeezed out to the periphery of the element 6 flows into the grooves 81-84, thus enabling to block the creep-out of the paste 7 onto the side surface of the element 6.

Inventors

• 👤 「だい」　克明
• 👤 Katsuaki Utena

Bibliographic Details