Semiconductor device

Abstract

Abstract PURPOSE:To offer the title device of high reliability by the secured connection of metallic fine wires to lead wires by providing projections which block the effusion of excess efflux generating at the time of fixing an element to an element mounting part. CONSTITUTION:After semiconductor elements 201a and 201b are fixed to element mounting parts 202a and 202b with an adhesive material 203b such as Au-Si eutectic alloy or Ag paste, the excess efflux thereof 210b is going to effuse out, but cannot effuse because of being blocked by the projections 211a and 211b. This projection is composed of solder resist, silicone resin, polyimide resin, etc., and provided at joints 208a, 208b between the mounting parts 202a, 202b and the connection parts 209a, 209b of the lead wires to the fine wires before the elements are fixed. The presence of this projection enables the secure thermal compression bonding of the metallic fine wires 207a, 207b of Au or Al without the contamination of Au or Ag plated layers 205b at the connection parts 209a, 209b of the lead wires 206a, 206b to the fine wires, resulting in the maintenance of high quality.

Inventors

• 👤 Toshio Kasuga
• 👤 春日　壽夫

Bibliographic Details