Hybrid integrated circuit device

Abstract

Abstract PURPOSE:To obtain an inexpensive hybrid integrated circuit having mass productivity and high reliability by providing an insulating layer on a base ribbon, further providing a circuit constituent, connecting an active element and a passive element, and resin-molding them. CONSTITUTION:An insulating layer 7 is formed on part of a base ribbon 1, and a circuit 6 of conductor is placed on the layer. Further, a semiconductor element 3, a resistor 8 and a capacitor 9 are placed on the circuit 6, and connecting wirings 2 are used to connect the necessary connections. Thus, even in a base ribbon system for facilitating the mass production and labor-saving, a hybrid integrated circuit can be manufactured.

Inventors

• 👤 Naoharu Senba
• 👤 仙波　直治

Bibliographic Details