Semiconductor device

Abstract

Abstract PURPOSE:To prevent an operation error even if a rate of change with time of a circuit current is large by a method wherein internal leads are bifurcated into two and one of them is connected to one group of the bonding pads which are divided into two groups by a metal thin wire and another pads group is connected to another group of the internal leads. CONSTITUTION:At least either of a high potential wiring and a low potential wiring of the wirings for supplying the electric power to a circuit chip 1 is divided into two groups and each group is provided with a bonding pad. Also, the internal leads of the internal leads 4 of a package 2 which said bonding pads divied into two groups should be connected with are bifurcated into two groups 6 and 7. Then, G' which is one group of the bonding pads is connected with one group of the internal leads 6 by a metal thin wire and another group G'' of the bonding pads is connected with another group of the internal leads 7 by a metal thin wire.

Inventors

• 👤 Manabu Ando
• 👤 学 安藤

Bibliographic Details