Manufacture of semiconductor device and tape to be used thereon

Abstract

Abstract PURPOSE:To unnecessitate the preparation of films having different hole sizes for every chip by a method wherein a large hole in which various kinds of semiconductor chips will be placed is provided in a film (tape), and a lead protruded in the hole is supported by an insulating member which is formed separately. CONSTITUTION:A device hole 15 of arbitrary size is provided on a polyimide film 11, a conductor 12 such as copper foil and the like is laminated, an insulating material 14 conforming to the size of a semiconductor chip is adhered to the film, an etching is performed on the conductor 12, and a tape for tape carrier element to be used for the system wherein semiconductor chips are continuously assembled on a film tape is formed. As a result, perforation of holes on the film according to chip size is unnecessitated, a number of tapes can be formed from a molding mold, thereby enabling to obtain effective results when semiconductor devices of multikinds are manufactured in a small quantity. The insulating member 14 is turned to the supporting material for prevention of deformation of the conductor protruded inside the hole after a wiring has been formed in the device hole.

Inventors

• 👤 Toru Kawanobe
• 👤 川野辺　徹

Bibliographic Details