Semiconductor device

Abstract

Abstract PURPOSE:To reduce thermal resistance, and to simplify structure and an assembly process by loading a semiconductor chip on a radiator fin through the cured layer of silicon rubber group adhesives having a thermal expansion coefficient, etc. coinciding with the characteristics of an silicon single crystal substrate constituting the semiconductor chip. CONSTITUTION:Silicon rubber group adhesives 14 are applied onto a radiator fin 13 made of a metal, a semiconductor chip with an silicon single crystal substrate is loaded on the upper surface of the adhesives 14, the same silicon rubber group adhesives 17 are applied so that a lead frame can be mounted, the semiconductor chip 18 is die-bonded onto the adhesive layer 14 by the adhesives 17, and the nose sections arranged in a plural number of the lead frame 19 are fixed. The whole is baked, pads on the semiconductor chip 18 and one tip sections of connector wires 20 are bonded through a known ultrasonic bonding method, etc., and the other tip sections of the connector wires 20 are bonded similarly with pads on the lead frame 19.

Inventors

• 👤 Kazuo Ito
• 👤 一夫 伊藤

Bibliographic Details