Resin composition for sealing semiconductor

Abstract

Abstract PURPOSE:To provide excellent reliability by using a filler which is smaller than the circuit width of a semiconductor element to be sealed with particle diameter. CONSTITUTION:An improper phenomenon is mostly caused in a sealed IC having an aluminum circuit 1 and a protective film 2 due to the influence of a large filler, by the abnormal circuit such as water introduction occurred in a microcrack 4 of a boundary between a resin bulk and a resin, water introduced occurred by a cracked damage 5 of a circuit protective film and displacement 5 or a deformation of the aluminum circuit. In other words, the present filler has larger particle diameter than the circuit width, the particle size distribution is wide, and large irregularity in the filling particle diameter with irregular local stress occurs. Then, the impropriety can be remarkably reduced by reducing the particle diameter smaller than the circuit width.

Inventors

• 👤 Shigeru Koshibe
• 👤 茂 越部
• 👤 Giyouji Hirata
• 👤 仰二 平田

Bibliographic Details