Electronic part

Abstract

Abstract PURPOSE:To suppress the production of a burr due to resin material from a sheathing material to exposed lead by molding an essential part of an electronic part body with the sheathing material formed of resin material and filler having less than 5mum of mean grain size. CONSTITUTION:A semiconductor element 3 is secured with solder material onto the upper surface of a heat dissipating plate 1, the electrode of the element 3 and its lead piece 2 are connected with a fine metallic wire 4, and the essential part of the electronic member is formed. The essential part is molded with a sheathing material formed of resin material 5a and a filler 5b having less than 5mum of mean grain size. With the constitution, it can suppress the production of a burr due to resin material from the sheathing material to the exposed lead piece 2 or the like and since the burr is not necessarily removed, the crack of the sheathing material can be entirely eliminated.

Inventors

• 👤 Hiroshi Yamada

Bibliographic Details