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JPS60163019A Expired / Lapsed JP ⏱️ 0.0 years remaining

Liquid crystal device

Assignee: Hitachi Ltd
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Filing: 1984-02-03
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Granted: —
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Expires: 2004-02-03
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Abstract

Abstract PURPOSE:To prevent breakage of a liquid crystal device owing to thermal stress of electrodes, peeling from a support, etc. by disposing a material having the coefft. of thermal expansion between the coefft. of thermal expansion of the electrodes and the coefft. of thermal expansion of the support as a thermal stress relieving layer between said electrodes and the support. CONSTITUTION:A material having the coefft. of thermal expansion between the coefft. of thermal expansion of electrodes 24 and the coefft. of thermal expansion of a support 22 is disposed as a thermal stress relieving layer 25 between the electrodes 24 and the base 22. The polyimide contg. the monomer expressed by the formula I or the polyimide contg. the monomer expressed by the formula II or the polyimide contg. the monomer expressed by the formula III (Ar2 is a dehydric aromatic group and Ar3 is a tetrahydric arom. group) is used as such material. These polyimides have about 10X10<-6>/ deg. coefft. of thermal expansion. On the other hand, the support 22 consisting of glass has about 3.25X10<-6>/ deg. coefft. of thermal expansion and the electrodes 24 have about 23X10<-6>/ deg.. The thermal stress generated owing to a difference in the coefft. of thermal expansion between the electrodes 24 and the base 22 as a result of generation of heat in the electrodes 24 is thus relieved and the breakdown and peeling of the electrodes 24 are prevented.

Inventors

  • 👤 Keiji Nagae
  • 👤 慶治 長江
  • 👤 Shunichi Numata
  • 👤 俊一 沼田
  • 👤 Tokuyuki Kaneshiro
  • 👤 徳幸 金城
  • 👤 Kazuyuki Funahata
  • 👤 一行 舟幡

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-08 01:06
CPC Classifications
G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/132; C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/1039; C08G73/1067; C08G73/1071

Claims Analysis

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References Cited (Backward Citations)

JPS5067081A Cited
JPS53138360A Cited
JPS55100892A Cited
JPS57192925A Cited
JPS58208730A Cited

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