Semiconductor device

Abstract

Abstract PURPOSE:To efficiently conduct heat generated in a semiconductor chip to a substrate, by providing heat-dissipating wiring sections in a part of multi-layered wirings so as to decrease the thermal resistance of the multi-layered wirings on the substrate. CONSTITUTION:Heat generated in a semiconductor chip 5 is efficiently conducted to a substrate 1 through soldered bumps 6 connecting the chip to thin film multilayered wirings 4 and through through-hole wiring sections 4B and heat dissipating wiring sections 4A formed in series. The heat dissipated in the whole thin film multi-layered wirings 4 is absorbed by heat dissipating wiring sections 4A serving as heat sinks, and therefore the thermal resistance of the whole thin film multi-layered wirings 4 can be reduced. The wiring sections 4A and 4B are not required for the purpose of electrical connection, while they are provided for improving the heat dissipation properties in the regions where there are no wirings 4. The wiring sections 4A and 4B are made of copper, gold or aluminium.

Inventors

• 👤 Chiyoshi Kamata
• 👤 千代士 鎌田
• 👤 Kanji Otsuka
• 👤 寛治 大塚
• 👤 Hiroshi Hososaka
• 👤 細坂　啓
• 👤 Kazuyoshi Sato
• 👤 和善 佐藤

Bibliographic Details