Manufacture of semiconductor light-emitting element

Abstract

Abstract PURPOSE:To manufacture a LED effectively by a method wherein array separating marks and chip separating marks are each formed to the surface and back of a laser wafer, and the wafer is separated along the array separating marks and formed to an array shape and separated under pressure. CONSTITUTION:Rolling pressure is applied to a laser wafer 1 while upward directing the back electrode 7 side, cracking stress is applied only to separating marks 2 for arraying, and the wafer 1 is separated into a large number of arrays. Rolling pressure is applied to the single array while upward directing the surface electrode 3 side, craking stress is applied to marks 8 for separating into chips, and the array 1' is separated into the chips.

Inventors

• 👤 Masayoshi Karuishi
• 👤 軽石　雅圭

Bibliographic Details