Semiconductor device

Abstract

Abstract PURPOSE:To prevent a resin material from cracking by forming an irregular surface for dispersing a stress on the front or back surface of a die stage, thereby suppressing a slip phenomenon due to thermal stress. CONSTITUTION:The shape that a central part 12a of a die stage 12 is projected, i.e., many small projections 22a are formed on a die stage 22, many raised portions are formed on the upper surface of the stage and the recesses are formed on the lower surface in a structure. This prevents between the stage and the resin material from slipping in any shape capable of avoiding the stress concentration at the edge of the stage. With such a shape, the stage has more edges to disperse the stress, thereby preventing the crack from occurring.

Inventors

• 👤 Akihiro Kubota
• 👤 昭弘 窪田
• 👤 Tsuyoshi Aoki
• 👤 強 青木
• 👤 Masao Takehiro
• 👤 武広　正雄
• 👤 Junichi Kasai
• 👤 純一 河西
• 👤 Michio Ono
• 👤 小野　道夫

Bibliographic Details