Electrically conductive resin paste

Abstract

Abstract PURPOSE:To provide a highly heat-resistant electrically conductive resin paste having a high initial bonding strength and suitable as mounting resin, prepd. by adding silver powder, a solvent, etc. to a polyimide resin consisting of a thermo- plastic polyimide resin and a thermosetting epoxy resin. CONSTITUTION:The resin paste is prepd. by adding silver powder, a solvent (e.g. N-methylpyrrolidone or dimethylformamide), a hardener (e.g. dicyandiamide), a curing accelerator (e.g. tertiary amine), etc. to a polyimide resin obtained by blending a thermoplastic polyimide resin (e.g. pyromelletic acid/diaminodiphenyl ether condensate type) with a thermosetting epoxy resin (e.g. epoxidized phenol novolac resin) in a blend ratio of 90-99.5:0.5-10 by weight. The paste is suitable for sealing semiconductor elements.

Inventors

• 👤 Shigenori Yamaoka
• 👤 重徳 山岡
• 👤 Yukihiro Okabe
• 👤 岡部　幸博
• 👤 Ryuzo Nakatsuka
• 👤 中塚　隆三

Bibliographic Details