Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To reliably isolate even if leads of a leadframe and a heat dissipating plate are contacted by the fine metal wire connecting work by forming an oblique portion or a projection on the parting surface of the lead of the leadframe and/or resin molding unit. CONSTITUTION:A heat dissipating plate 2 is supported by hanging pins 3, 3 between frames 1 and 1 extending in parallel. Leads 6 formed of a plurality of lead pieces 61-67 are supported by die bars 4, 5 for bridging between the frames 1 and 1 to form a leadframe. A semiconductor element 1 is secured on the upper surface of the plate 1, and the electrodes and the pieces 61-67 are connected by fine metal wirings 8. The leadframe is set so that the plate 2 is disposed on the lower mold 9a of a resin molding unit 9. An ascent oblique part 10 is formed toward the cavity on the parting surface adjacent to the cavity of the mold 9a. The leadframe is interposed between the mold 9a and an upper mold 9b.

Inventors

• 👤 Hiroshi Yamada
• 👤 寛 山田

Bibliographic Details