Semiconductor device

Abstract

Abstract PURPOSE:To prevent breaks or cracks due to the collision of packages and then facilitate automation of a sorting process, etc. by a method wherein conductive substance is so deposited on a metallized surface as to project out of a package surface. CONSTITUTION:The conductive substance 6 is deposited on metallized layers 3, formed from slightly above the center in grooves 2 on the side surface of the leadless chip carrier type package 1 to the bottom, and on the metallized layers 3 of the bottom surface. The thickness of this conductive substance 6 is so selected that it projects out of the side surface of the package 1 to the outside by a dimension d1. The conductive substance 6 projects out of the bottom surface by a dimension d2 besides on the bottom surface side of the package 1. The material of the conductive substance 6 is a low melting point metal such as solder or a conductive resin. Therefore, since the conductive substance 6 projects out of the side surface and the bottom surface of the package 1, the conductive substance 6 has buffer action; there is no possibility of direct contact of each ceramic material of the package 1, and breaks or cracks of the package 1 can be prevented.

Inventors

• 👤 Kazuo Saito
• 👤 一男 斎藤

Bibliographic Details