Semiconductor device

Abstract

Abstract PURPOSE:To efficiently dissipate heat even if the quantity of heat is increased by efficiently dissipating the heat generated from a semiconductor element by employing a heat conductive layer formed in contact with the surface of a semiconductor substrate. CONSTITUTION:A heat conductive layer 5 is formed of good heat conductor such as metal in contact with the surface of a semiconductor substrate 1. A heat conductive wire 6 is used to lead the heat from the layer 5 by means of conduction to a package 3. The heat generated at the substrate 1 is, as shown by an arrow, escaped to a route to the package 3 via the wire 6 from the layer 5 in addition to the conventional heat conduction route. Accordingly, the heat is led efficiently to an external cooling fin 4. The difference of the efficiency of heat conduction is made more clear when a semiconductor substrate 1 is composed of an insulator such as an SOS.

Inventors

• 👤 Masayoshi Sasaki
• 👤 佐々木　正義

Bibliographic Details