Manufacture of semiconductor element

Abstract

Abstract PURPOSE:To divide a slender crystal body into individual semiconductor elements without giving damage on the side surface thereof by using an adhesive tape for fixing a wafer formed like a bar, generating flaw like V-shaped groove, limiting the flaw generating area only to the central area except for the edge part in the width of 10mum and by rotating a cylindrical bar body on the rear surface of wafer. CONSTITUTION:A slender crystal body 12 having the two parallel side surfaces in the longitudinal direction is attached to an adhesive tape 13 with the side surface 11 crosses orthogonally with the adhesive tape surface with the crystal body surface 14 is opposed to the contact surface with the tape. The flaw like the V-shaped groove 23 is generated with a constant interval with a needle- shaped or wedge-shaped jig 22 at the area on the crystal body surface 14 separated by 10mum or more from the crossing line 21 of the surface 14 and side surface 11 in the direction vertical to the side surface 11. A cylindrical bar 32 which is placed in such a way that the axial direction becomes parallel to that of V-shaped flaw 23 on the rear surface 31 of the crystal body 12 having the flaw 23 through the adhesive tape 13 is rotated while it is given a load. Thereby, individual elements 33 can be obtained.

Inventors

• 👤 Hideaki Noguchi
• 👤 英明 野口

Bibliographic Details