Manufature of semiconductor device

Abstract

Abstract PURPOSE:To enable to dissipate the heat of a semiconductor chip effectively without adding excessive load on said semiconductor chip by a method wherein a gap with which no heat conductivity will be impaired is provided between a metal plate, which is used as a medium of heat conduction from the semiconductor chip to the heat dissipating device, and a heat radiating device. CONSTITUTION:On the back side of each flip chip 5 mounted on a module substrate 7, a bonding agent 14 of excellent heat conductivity on low melting point metal and the like such as indium and solder, and a metal plate 13 of excellent heat conductivity such as copper, aluminum and the like are placed, and the cap 2 consisting of ceramic and the like is placed on a module substrate in such a manner that a bonding agent is pinched. When the above is passed through a heated atmosphere, said cap 2 and the module substrate 7 are joined together and, at the same time, a flip chip 5 and the metal plate 13 are also joined together. As a bonding agent 14 contracts when it is fused and solidified, a small gap 15 is generated between the metal plate 13 and the cap 2. Subsequently, a heat sink 1 is joined to the a cap 2 using a bonding agent 3 having excellent heat conductivity.

Inventors

• 👤 Masanobu Obara
• 👤 小原　雅信
• 👤 Hiroshi Shibata
• 👤 浩 柴田
• 👤 Shin Nakao
• 👤 中尾　伸

Bibliographic Details