Semiconductor device

Abstract

Abstract PURPOSE:To obtain a device which can be easily mounted on a substrate by having linear external leads led out from a sealed outer shell and external leads with tips bent rectangularly before the most tip of the linear form. CONSTITUTION:The leads 9-11 led out of the sealed outer shell 1 have the linear parts 14-16, and the leads 12 and 13 have the parts 17 and 18 bent rectangularly. The leads 9-11 are inserted into through holes of the substrate 5, and thus mounted on the substrate 5 with the bent parts of the leads 12 and 13 as stoppers. This constitution does not lose stopper function even when the lead width is reduced; therefore the number of leads which can be led out of a package of a specific size increases, and accordingly an IC device of a substantially high integration degree can be loaded. This constitution can be applied to any one of a dual line type and single-in-line type packages, and remarkable miniaturization can be realized by the reduction of lead center intervals.

Inventors

• 👤 Katsuhiko Tsuura
• 👤 克彦 津浦

Bibliographic Details