Resin seal type semiconductor device

Abstract

Abstract PURPOSE:To obtain a sealing device of wetproof property and heat-resisting property by constituting a sealing resin by an epoxy resin, a curing agent with at least two phenolic hydroxyl groups, an organic phosphine compound and polyethylene oxydiglycolic acid. CONSTITUTION:One or two kinds of novolac type phenol resins as a curing agent are used as phenol novolac type resins of 170-300 epoxy equivalent, not more than 10ppm Cl ions and not more than 0.1wt% hydrogenizing Cl, and compounded by 0.5-1.5 in phenolic hydroxyl group number/epoxy group number, triaryl phosphine is added by 0.01-5wt% of the sum of the epoxy resin and the curing agent to promote curing, and polyethylene oxydiglycolic acid of approximately 250-3,300 mean molecular weight is used jointly by approximately 0.1- 30wt% to the epoxy resin. When the device is sealed with the resin by said constitution, a disconnection due to the corrosion of Al is also reduced remarkably, and the device of high reliability is obtained.

Inventors

• 👤 Hirotoshi Iketani
• 👤 池谷　裕俊

Bibliographic Details