Measuring apparatus for semiconductor device

Abstract

Abstract PURPOSE:To prevent generation of damage of semiconductor by sensor spine and simplify adjusting operation by eliminating sensor spine through common use of probe spine for measuring electrical characteristic of semiconductor device and detecting position of measuring part. CONSTITUTION:Spines 11, 12 of probe spines 11-13 are commonly used as the sensor spine. After defining the positional relation between bonding pad and probe spine, it is used as the probe spine by electrically separating it from the sensor circuit connected to the sensor spine. This prober apparatus detects wafers 1 from existence of current. Namely, when the stage is located at the lower position, a prober current does not flow into the probe spine, but when the stage is located at the upper position and wafer is in contact with probe spines 11, 12, a sensor current flows across the probe spines. This sensor current causes a relay 14 to operate in order to separate from the sensor circuit 15. During this operation, the stage 8 moves upward and stops at the specified height. A little layer, a prober current flows into the prober spines 11, 12, 13 and measurement starts.

Inventors

• 👤 Mutsuo Kubo
• 👤 久保　睦雄

Bibliographic Details