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JPS5947728A Expired / Lapsed JP ⏱️ 0.0 years remaining

Method and apparatus for plasma coating

Assignee: NTT Inc
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Filing: 1982-09-10
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Granted: —
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Expires: 2002-09-10
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Abstract

Abstract PURPOSE:To form high quality films of materials in very wide range at a low temperature, facilitate maintenance and improve yield by ionizing sputter atoms with plasma flow and forming a film by giving kinetic energy. CONSTITUTION:A magnetic coil 10 is provided at the circumference of a plasma generating chamber 1 and intensity of magnetic field generated thereby is determined so that the condition of resonance of electron cyclotron by microwave is established at least at a part of inside of plasma generating chamber 1. Moreover, a magnetic field generated by a magnetic coil 10 not only serves for resonance of electron cyclotron in the plasma generating chamber 1 but also effectuates a sample chamber 2. The M atoms sputtered are ionized into M<+> within the flow of plasma 6 and is integratingly transferred to a sample board 8 together with the flow of plasma 6. Thereby, a thin film is formed. Accordingly, a film is formed only to a region limited where the sample board 8 is irradiated by the flow of plasma 6 and the film can be formed very efficiently.

Inventors

  • 👤 Seitaro Matsuo
  • 👤 松尾 誠太郎
  • 👤 Toshiro Ono
  • 👤 俊郎 小野

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-07 20:19
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/32009; H01J37/32192; C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/35; C23C14/354; C23C14/357; C23C14/46; H01J37/34; H05; H05H; H05H1/00; H05H1/02; H05H1/16; H05H1/18; H05H1/24; H05H1/46

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