Resin composition

Abstract

Abstract PURPOSE:A composition, prepared by incorporating a fine spherical inorganic filler with a resin, capable of giving molded articles having smooth surfaces, and suitable for sealing materials of electronic parts, etc. without the fear for abrading apparatuses. CONSTITUTION:A resin composition prepared by incorporating 100pts, resin with 10-1,000pts.wt. spherical inorganic filler having 0.1-1,000mu particle diameter, preferably alumina. The preferred particle diameter of the inorganic filler is particularly about 50mu within the above-mentioned range, and the width of the particle diameter distribution is preferably small for the uniform dispersion.

Inventors

• 👤 Masahiro Matsumura
• 👤 松村　昌弘
• 👤 Tetsuo Kunitomi
• 👤 国富　哲夫
• 👤 Yoshikazu Nishikawa
• 👤 嘉一 西川
• 👤 Kensaku Morii
• 👤 森井　賢作

Bibliographic Details