Method and apparatus for probe alignment of semiconductor element inspecting apparatus

Abstract

Abstract PURPOSE:To easily execute accurate alignment by correcting position of wafer support base through detection of angular displacement and positional displacement using a dummy wafer outside the inspecting position. CONSTITUTION:A wafer 4 which may be damaged by a probe is placed on a wafer support base 6, it is then moved to the inspecting position B and traces of probes a', b', c' and d' are given on such wafer. A dummy wafer 4 is transferred to the position C isolated by a certain distance from the position B and an angular displacement and positional displacement of the wafer support base 6 are obtained by utilizing an intersecting point (e) of the cross line of a microscope. Thereafter, the wafer support base 6 is returned to the initial position A and displacement is corrected. Thereby, correction can be realized without directly inspecting and correcting the relation between the probe and an electrode.

Inventors

• 👤 Shunichi Sasaki
• 👤 俊一 佐々木

Bibliographic Details