Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To enable to reduce the manhours required for the manufacture, to cut down the cost of production and to contrive lightweight of the semiconductor device by a method wherein an auxiliary fin is used and, at the same time, a semiconductor chip and a cooling fin are fixed simultaneously, thereby enabling to simplify the structure of the semiconductor device. CONSTITUTION:A semiconductor chip such as a diode chip 7, for example, is fixed to an auxiliary fin 6 by performing a thermo-press welding through the intermediary of high melting point solder 8a. Then, an external lead 1 is fixed to the diode chip 7 by performing a thermo-press welding through the intermediary of high melting point soldering material 8b, and then the auxiliary fin 6 is fixed to a cooling fin 5 by performing a thermo-press welding through the intermediary of high melting point soldering material 8c. Subsequently, after the high melting point soldering materials 8a-8c have been welded simultaneously by passing them through a heat treatment oven, a resin molding work is performed using molding resin 2.

Inventors

• 👤 Takashi Kamikawa
• 👤 上川　孝

Bibliographic Details