Manufacture of resin sealed type electronic part

Abstract

Abstract PURPOSE:To enable to continuously produce multikind parts of a small quantity as well as to reduce the percentage of rejects by a method wherein, after a molded article has been adhered to the upper and lower surfaces of a lead frame through the intermediary of a binding material layer, an element is die-inner bonded on the molded article and then said element is sealed by performing a bonding. CONSTITUTION:After the molded articles 7 and 7', consisting of phenol resin, epoxy resin and the like, have been formed in one body by adhering them on the upper and lower surfaces of a metal lead frame 1 through the intermediaries of the binding material layers 6 and 6' consisting of phenol resin, epoxy resin and the like, a resin sealed type electron part is obtained by sealing the element 2 using a casting material consisting of phenol resin, epoxy resin and the like after the element has been die-inner bonded 8 on the molded article. In this case, it is necessary that the molded articles are formed in one body by adhering them to the upper and lower surfaces of the lead frame. It is desirable that one each of the molded articles is adhered to the upper and lower surfaces of the lead frame. The binding material layers may be formed by applying a bonding agent or by spraying it and the like, and the binding material layers may also be formed through the intermediary of a bonding sheet and the like.

Inventors

• 👤 Hirokuni Mamiya
• 👤 間宮　洋邦
• 👤 Teruyoshi Shibata
• 👤 柴田　輝義

Bibliographic Details