Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To produce a semiconductor device with high reliability at low cost by a method wherein a semiconductor body excluding its main surface is buried in a hole of substrate with insulating material to heap the laminating layers whereon electrolytic copper foil is stuck on a polyimide film connecting to semiconductor pellet through the opening of the substrate. CONSTITUTION:A band-like sheet 9 with adhesive layer 8 is stuck on a substrate 7 with a hole 6 arrayed and finished very precisely then an Si pellet 10 is inserted into the hole 6 and a polyimide resin 11 is buried in the gap between them and the surface of the substrate 7 is flattened and after hardening the whole body, the sheet 9 is peeled off. Another hole 14 is opened in a polyimide film 12 corresponding to the electrode of the pellet 10 and a laminating layer coated with an external lead 13 made of electrolytic copper foil is provided corresponding to the hole 14. Firstly the film 12 is stuck on the substrate 7 to be connected 15 collectively at one time by means of plating process. Secondly the whole body is covered with the polyimide resin films 16, 17 print-forming a solder electrode 18. Finally the process is finished by means of dicing. In such a constitution, the pellet of normal Al electrode may be finished into wireless flip chip structure at low cost producing a semiconductor device with high reliability.

Inventors

• 👤 Toru Abe
• 👤 亨 阿部
• 👤 Takeshi Takagi
• 👤 武 高木
• 👤 Satoshi Iida
• 👤 智 飯田

Bibliographic Details