Pressure welding type semiconductor device

Abstract

Abstract PURPOSE:To equalize stress distribution in a semiconductor element base body by interposing a metallic plate for dispersing pressure, a peripheral section thereof is thicker than a central section, between a point-contact jig and the base body when metallic stamps and cooling fins are each stacked to both surfaces of the base body and a pressure plate is set up onto the cooling fin through the point-contact jig. CONSTITUTION:A temperature-compensating plate 11 in Mo, etc. is brought into contact with one surface of the semiconductor element base body 10, and a mechanical support plate 12 in W, etc. is brought into contact with the other surface. The cooling fins 15, 16 in Al are each set up to the outsides of the plates through the electrode metallic stamps 13, 14, and a base body 10 section is surrounded by a package 22. A lower pressure plate 21 is mounted on the fin 16 side through an insulating plate 18, and the pressure plate 20 is also mounted on the fin 15 side through an insulating plate 17 and the point-contact jig 19, but the metallic plate 41 for dispersing pressure, the peripheral section thereof is thicker than the central section, is inserted previously between the fin 15 and the insulating plate 17 in addition to the installation of the pressure plate 20. Accordingly, force concentrating to the jig 19 is re-dispersed, and stress is made uniform.

Inventors

• 👤 Katsuhiko Takigami
• 👤 滝上　克彦

Bibliographic Details