Semiconductor device

Abstract

Abstract PURPOSE:To obtain the semiconductor device, which can be loaded easily in a case of the number of pins desired by users and particularly belongs to a master-slice type, by putting a pad row for bonding formed along at least one side of a chip aside toward a corner of the chip and arranging the pad row while leaving space to the central section of one side. CONSTITUTION:The chip-pads 1'-8' are put aside toward a corner of the chip, and arranged except the central section of one side A. Consequently, an angle C' that a bonding wire 17' connecting the chip-pad 6' and a case-pad 15 forms together with one side A enlarges, an accident of which the bonding wire 17' is in contact with the chip-pad 7' is eliminated, reliability is improved, and the length of the bonding wires is shortened, thus enhancing the quality of the device, also. Even when difference 2B between the island-size of the case and chip-size increases, the bonding wires are not lengthened while the length of each bonding wire is also equalized, effects due to the reistance of boding wire themseleves and inductance and the like are hardly produced, and quality is improved.

Inventors

• 👤 Kenji Okada
• 👤 賢治 岡田
• 👤 Hiroyuki Misawa
• 👤 三沢　弘行

Bibliographic Details