Lead frame for semiconductor device

Abstract

Abstract PURPOSE:To reduce an effect on a lead for an external lead-out generated on a cutting by separating the end surface of a clearance in an outer frame from the extension of the central line of the lead for the external lead-out. CONSTITUTION:A clearance 25, an end surface 251 thereof does not coincide with the extension of the center 27 of a lead 23 for an external lead-out, is formed to an outer frame section 22. Accordingly, possibility resulting in the deformation of the lead 23 for the external lead-out can be inhibited even when strain on processing in a cutting 26 is generated in the end surface 251 of the clearance 25.

Inventors

• 👤 Shunichi Kon
• 👤 近　俊一

Bibliographic Details