Heat dissipating member for heat generator

Abstract

Abstract PURPOSE:To reduce the thermal stress generated in a semiconductor element by decreasing the thermal resistance by a method wherein junction is performed by interposing an intermediate member made of porosity of good thermal conductivity between said element generating heat and a heat dissipator, when said dissipator is adhered to said element. CONSTITUTION:When the semiconductor element 4 is adhered to the lower surface of a disk 2 surrounding a copper stud 1, the intermediate member made of a porous member 3 such as copper is interposed between the disk 2 and the element 4. This porous member 3 is fabricated by the compression sintering by a copper powder metallurgical method and is made to have a deisred rate of vacancy. Thereafter, the lower surface of the outer periphery of the disk 2 is brazed to a ceramic body 6 surrounding the element 4, and the terminals provided to the element 4 are connected to lead wires 8 by means of fine wires 5. Next, while the outer end of the lead wire 8 is led out, a ceramic body 9 serving as the bottom is fixed to the ceramic body 6 with sealing glass 7, thus sealing the element 4.

Inventors

• 👤 Tetsuo Kumazawa
• 👤 熊沢　鉄雄
• 👤 Hiroaki Doi
• 👤 土居　博昭
• 👤 Tatsuji Sakamoto
• 👤 坂本　達事

Bibliographic Details