Semiconductor laser device

Abstract

Abstract PURPOSE:To transmit heat generated by a semiconductor laser element efficiently over a heat sink by providing the heat sink with sections to be joined joining with at least two surfaces of a substrate constituting a semiconductor laser device. CONSTITUTION:A section to be joined 4 consisting of recessed section formed to the upper surface of a heat sink 2 in predetermined depth has a bottom 4a and three side-surfaces 4b-4d connected to the bottom 4a. The bottom of the substrate 1a of a semiconductor laser element 1 and three side surfaces except a side surface on the output end surface 1c side of a laser oscillation section 1b are joined with the bottom 4a and side surfaces 4b-4d of the section to be joined 4 by a joining material 3. Consequently, the temperature rise of the element 1 can be inhibited because the back and three side-surfaces of the element 1 are joined with the heat sink 2 and the heat sink 2 is joined up to a section in the vicinity of the oscillation section 1b. Accordingly, an output from a semiconductor laser device can be increased.

Inventors

• 👤 Kazunori Moriki
• 👤 森木　一紀
• 👤 Jun Osawa
• 👤 大沢　潤
• 👤 Kenji Ikeda
• 👤 健志 池田
• 👤 Wataru Suzaki
• 👤 須崎　渉

Bibliographic Details