Epoxy resin molding material

Abstract

Abstract PURPOSE:To provide an epoxy resin molding material which is suitable for use in the sealing of electronic parts and in which stress is lowered without lowering moisture resistance, by adding a silicone intermediate. CONSTITUTION:A silicone intermediate is added to an epoxy resin molding material. As the principal ingredient, novolak or bisphenol type epoxy resin is used as the resin component and optionally, additives such as hardener, filler, pigment, parting agent, reinforcing agent, etc. are blended. The silicone intermediate is added at any state of the production of the molding material. As the silicone intermediate, an amino-modified silicone intermediate is preferred. When 1- 15pts.wt. silicone intermediate is added to 100pts.wt. epoxy resin, flexural modulus is lowered, no uneveness in appearance is formed and stress can be lowered without lowering moisture resistance.

Inventors

• 👤 Hirohiko Kagawa
• 👤 香川　裕彦
• 👤 Yasuhiro Kyotani
• 👤 京谷　靖宏

Bibliographic Details