microwave integrated circuit

Abstract

Abstract PURPOSE:To obtain a microwave integrated circuit which has superior performance and superior workability of manufacturing by connecting earth electrodes on one surface of a dielectric substrate so that they are closest to the ground plane of the other surface. CONSTITUTION:Through holes 16 and 16' are bored in the dielectric substrate 15 and hollows 17 are formed around the through holes 16 and 16' on the rear side of the substrate 15, so the substrate 15 is thinner near the through holes 16 and 16' than at any other part. Further, the rear side of the substrate 15 is metallized including the parts of the hollows 17 to form the ground plane 18. Conductor electrodes 19 and 19' on the surface of the substrate 15 are connected as earth terminals to the ground plane 18 by metallized electrodes 20 and 20'. Thus, the microwave integrated circuit which has superior performance and superior workability of manufacturing is obtained.

Inventors

• 👤 Tomoki Ueno
• 👤 伴希 上野

Bibliographic Details