Bonding method

Abstract

Abstract PURPOSE:To strengthen the junction part between a semiconductor chip and a substrate and accordingly facilitate the positioning of the junction by a method wherein bumps of a semiconductor chip are directly connected to a non-plated conductor foil on the substrate, and stepwise differences are generated at the connection and non-connection parts between the bump and foil. CONSTITUTION:The photo resist 6 pattern is formed at the part corresponded to the bonding between the bump of the semiconductor chip and the Cu foil on the substrate 3 constituted of glass epoxy wherein the Cu foil is laminated. Next, the plating 5 to prevent the oxidation of the Cu foil 4 is performed according to a conventional technique. When the photoresist 6 is washed off, with the Cu foil 4 as the bottom, a recess 7 is formed at a part of the plating 5. In the recess 7, the Cu 2 and solder 2b bumps 2 of the semiconductor chip 1 such as an LSI are fitted. The soldering is completed by the solder 2b of the bump 2.

Inventors

• 👤 Shin Tada
• 👤 多田　伸

Bibliographic Details