Forced restitution device of wafer-shaped compensation chuck

Abstract

Abstract PURPOSE:To forcibly restore a concave deformation on a chuck face by enabling a pressurizing means for setting displacement of the chuck face to operate also in the direction of restoring said concave deformation. CONSTITUTION:Water 1 with a thick central part is adsorbed and maintained by matching the amount of concave deformation of a diaphragm chuck 2 with the shape of wafer 1 through setting conductive an electromagnetic coil 8a of a solenoid valve 8 and making a communicative pattern of (A). When working of wafer 1 is completed in its condition of being adsorbed, conductivity to the coil 8a is cut, and the communicative pattern is made (B), adsorption being removed. Then the central part of the diaphragm 2 is pushed up by means of a piston rod 6c, and the upper face of the chuck 2 is restored to a plain surface.

Inventors

• 👤 Toshihiko Tsurumi
• 👤 敏彦 鶴見

Bibliographic Details