Resin composition

Abstract

Abstract PURPOSE:To obtain a thermosetting resin composition with adequate heat and chemical resistance, suitable for printed wiring boards, comprising an epoxy resin and a graft copolymer composed of a polyphenyene ether and a phenolic hydroxyl group-contg. styrene compound. CONSTITUTION:The objective resin composition comprising (A) an epoxy resin (having >=2 epoxy groups in are molecule) and (B) a copolymer prepared by grafting, to a polyphenylene ether composed of an unit of formula (R1-R4 are each H, halogen, or 1-4C alkyl), a styrene compound carrying phenolic hydroxyl group (S) (e.g., hydroxy-styrenes) and having >=1 phenolic hydroxyl group per one polyphenylene ether molecular chain. In case the amount of the hydroxyl group in said graft polymer is >=1 equivalent per eq. of the epoxy group in said epoxy resin, additional incorporation of a curing agent would be effective for maintaining the properties of final cured products.

Inventors

• 👤 Norio Tsujioka
• 👤 則夫 辻岡

Bibliographic Details