Manufacture of solid state image pickup device

Abstract

Abstract PURPOSE:To obtain a solid state image pickup device which can reduce its packaging cost to less than 1/5 of a conventional hermetical seal type and which has reliability longer than the same 20 years as the hermetical seal type by mechanically machining the surface of the resin filled and hardened in the hollow part in a substrate flatly. CONSTITUTION:Acrylic resin 12 which is heated in the shape designated by broken line 11 is filled and hardened by an injection molding method using a mold in the hollow part of a substrate 1. Thereafter, in order to accurately and completely passing an external optical information, the surface is polished, thereby removing the damage and ruggedness on the surface and finishing it to a smooth surface 13 which is parallel to the photodetecting surface of a solid state image pickup element and is completely falt.

Inventors

• 👤 Yoshiyuki Tsujita
• 👤 辻田　嘉之
• 👤 Masayoshi Ezawa
• 👤 江澤　正義
• 👤 Mikio Ashikawa
• 👤 芦川　幹雄

Bibliographic Details