Reactive ion etching

Abstract

Abstract PURPOSE:To apply uniform reactive ion etching by a method wherein an etching period and an idling period are alternately repeated during one time of etching. CONSTITUTION:In a reactive ion etching used a parallel-plate electrode 2, the temperature of a substrate rises by the collision of ions, high-speed neutrons, thermal radiation from plasma, and chemical reaction. At the time, the part having a large etching area differs from that having a small area in surface termperature because of the relation of heat radiation an the uniformity of etching rate is missed to unequalize pattern width. Then, high-frequency voltage is intermitted by switching operation and areaction product influence over etching is decreased by excluding the reaction product during a non-etching period and extremely uniform ething can be applied by constantly maintaining the surface temperature even if the etching area differs in the substrate.

Inventors

• 👤 Masakatsu Saito
• 👤 正勝 斎藤
• 👤 Akitsuna Yuhara
• 👤 章綱 湯原
• 👤 Isao Oshima
• 👤 大島　勲

Bibliographic Details