Epoxy resin composition for molding

Abstract

Abstract PURPOSE:To provide an epoxy resin compsn. which does not cause mold staining, has excellent mold release characteristics and exhibits strong adhesion when used as printable semiconductor sealant, prepared by adding organopolysiloxane having a specified group capable of reacting with epoxy resin. CONSTITUTION:The compsn. is prepared by adding 0.01-10pts.wt. organopolysiloxane containing at least one organosiloxane unit of the formula in one molecule[where R<1> is a (substd.) univalent hydrocarbon group excluding R<2>; R<2> is a univalent hydrocarbon group having an epoxy, amino, OH, COOH or carboxylate ester group; a is 0-2; b is 1-3; a+b is 1-3]and having a viscosity of 1,500, 000 cSt and a hardener (e.g. phthalic anhydride) to 100pts.wt. epoxy resin (e.g. diglycidyl ether of bisphenol A). USE:General purpose molding material, heat-resistant varnish, casting, impregnation, coating (including powder coating)

Inventors

• 👤 Taro Koshii
• 👤 越井　太郎
• 👤 Yoshiji Morita
• 👤 好次 森田

Bibliographic Details