Liquid-cooled module

Abstract

Abstract PURPOSE:To provide a liquid-cooled module which enhances its heat sink effect by forming a structure having no horizontal part for coolant liquid surface on the top inner wall of a container which fills coolant. CONSTITUTION:Heat which is generated by a heater 13 such as an LSI or the like is removed as evaporation heat when coolant liquid 14 is evaporated to become vapor 15, the vapor is then condensed on the inner wall 12 of a container and is transmitted to the exterior of a module. At this time the inner wall 12 is formed in fin shape with large surface area. Accordingly, the vapor 6 is rapidly condensed to become coolant liquid. Simultaneously, the inner wall 12 is inclined and is formed in a spherical shape, with the result that the condensed liquid is not stored as a liquid layer and does not disturb the transfer of the heat dissipated from the condensed new vapor. Since the layer of the liquid stored on the fin is reduced in thickness so that the thermal resistance of the module can be lowered, the cooling effect of a semiconductor device utilizing liquid cooling can be raised. When the inner wall 21 is formed in sawtooth shape, the surface area is further increased, thereby further increasing the cooling effect.

Inventors

• 👤 Kishio Yokouchi
• 👤 貴志男 横内
• 👤 Nobuo Kamehara
• 👤 亀原　伸男
• 👤 Koichi Niwa
• 👤 丹羽　紘一

Bibliographic Details