thermal head

Abstract

Abstract PURPOSE:To minimize the thermal warping of a substrate carrying heat generating elements by sticking it on a mount plate with a hardening type adhesive adapted to be rubber-elastic when hardened. CONSTITUTION:A ceramic substrate 1 carrying trains of heat generating elements 7 is stuck on a mount plate 2 with an adhesive 11 adapted to be elastic like rubber when hardened. For example, a silicone adhesive can be used for the adhesive providing a rubber-like elastisity when hardened. If the adhesive became hard when hardened, the substrate 1 would bend due to a sort of bimetal effect developed by a difference in the coefficient of thermal expansion between the substrate 1 and the mount plate 2, which eventually will causes a change in the printing density. It is preferable that a concave groove is provided longitudinally on the mating surface of the mount plate 2 so that the substrate 1 will be applied thereon with the adhesive 11 filling the groove 12.

Inventors

• 👤 Toyokazu Inaba
• 👤 稲葉　豊和
• 👤 Takemi Maruyama
• 👤 丸山　威美

Bibliographic Details